Napson
WS-3000
Napson Corporation
The Pioneer for Sheet Resistance / Resistivity Measurement
Napson Corporation is a global leading four-point-probe and non-contact eddy-current measurement equipment manufacturer in resistivity and sheet resistance measurement equipment for the semiconductor and display industry.
Napson is developing and manufacturing both technologies in-house. With this know-how, they offer ‘Flexible solutions’ from benchtop testing over fully automatic or continuous in-line scanning measurement solutions to single-point or mapping solutions.
Napson also has developed equipment for related technologies including lifetime testing, spread resistance measurement, P/N type checking, flatness testing TCR solutions for temperatures up to 1200 °C.
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4-point-probe head on wafer
Contact-Type
The contact-type resistance measurement instruments use 4-point-probes heads and 2-point-probe heads to contact the sample for the measurements. It provides a wide measurement range, from µΩ/sqr up to GΩ/sqr or even to PΩ/sqr and is suitable for various samples.
The contact systems can be used to measure resistivity, thickness, conductivity (P/N), and substrate temperature for corrections. It contains a tester with self-test-function and entails a measurement correction function for resistivity (thickness, temperature end edge measurement position).
It is available in fully-automatic, semi-automatic, and manual handlings.
The semi-automatic systems use programmable measurement patterns. The full automatics systems use a robotic handling system for cassette-to-cassette wafer or substrate loading and unloading. It can also be used for wafer sorting.
Suggested applications obtain semiconductor materials, solar-cell materials (silicon, polysilicon, sic, etc), new and functional materials (carbon nanotube, DLC, graphene, ag nanowire, etc.), conductive thin films (metal, ITO, etc.), and for diffused layers or samples.
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Non-Contact-Type
The non-contact-methods are used for non-contact type resistance measurement instruments and uses for example paired eddy-current probe heads for the measurement. That ensures that no damage will be made by any contact to the substrates and there will be no influence of contact resistance between the probes and materials.
It is available in fully-automatic, semi-automatic, and manual handlings.
Fully automatic, non-contact-systems measure resistivity with the Eddy current method, wafer thickness with the electric capacitance, and conductivity (P/N-Tester). It allows temperature correction for wafer and non-contact measurements of ITO film, metal thin films on flat panel. An automatic X-Y and Z (eddy current probe head) axis moving mechanism is integrated into the instrument for substrate mapping.
The semi-automatic systems offer customer-defined programmable measurement patterns. It is equipped with a tester self-test function and provides a wide measuring range. It is possible to measure a wide range of sheet resistance by installing max. 4 probes.
Manual handlings allow easy operation and a compact design. It automatically starts the measurement after a wafer is inserted under the probe. It contains 5 types of models for each measuring range.
Suggested applications obtain semiconductor materials, solar-cell materials (silicon, polysilicon, sic, etc), new and functional materials (carbon nanotube, DLC, graphene, ag nanowire, etc.), conductive thin films (metal, ITO, etc.), silicon-related epitaxial materials, ion-implantation sample, and chemical compound semiconductor (GaAs Epi, GaN Epi, InP, Ga, etc.).
FLA-200
EC-80P
CRESBOX
SRS-2010
The FLA-200:
The FLA-200 is a non-contact measurement system that offers contactless thickness, TTV, bow, warp and site, and global flatness measurements. Through its highly accurate 5 mm in diameter core capacitance sensors, it allows a full 500-micron thickness measurement range without any re-calibration. It works with a 2-D /3-D mapping software.
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Do You Have Questions?
Feel free to give us a call:
+49 89 35 09 578 -0
Klaus Gailus
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