Selective Vacuum Chuck 200mm
End-Effector for 200 and 300mm wafers
CoreFlow is a world-class solution provider of high accuracy handling and conveying aeromechanical systems to the semiconductor and Flat Panel Display (FPD) industries. CoreFlow develops, manufactures and markets its products to equipment manufacturers and end-users in these industries. With more than 800 installations worldwide, CoreFlow’s handling platforms can be found on the production floors of many top FPD manufacturing fab plants, such as Samsung, LG, Sony, and more. In these fabs, CoreFlow products reliably handle the glass substrates.
The heart of CoreFlow’s technology is SmartNozzle™. This unique Nozzle enables the precise floating of the processed substrate.
In the FPD market, CoreFlow’s non-contact air floating systems transport substrates (glass or/and wafer) of any size, thickness, and weight (including the latest G10.5 and 0.1 mm thicknesses), between and within process systems with the utmost air-gap accuracy.
In the semiconductor market, CoreFlow products can be found inside inspection and material characterization machines.
Driven by the SmartNozzle™, CoreFlow’s selective vacuum solution addresses the challenges of handling warped wafers. Utilizing this self-controlled nozzle technology, CoreFlow’s handling mechanism acquires the wafer even when only a fraction of the vacuum array is covered.
CoreFlow’s wide range of products brings several decades of combined aeromechanical expertise to deliver manufacturing solutions with unmatched quality, accuracy, and stability – solutions that minimize your risk and maximize your manufacturing yield and throughput. CoreFlow’s headquarters and research facilities are based in Israel, with sales representatives located in Germany, Korea, Japan, Taiwan, and China.
Handling of Thin Wafers
- Thin wafers (<100 µ) represent challenges. The wafers are often warped and very brittle.
- Standard end effectors occasionally do not acquire the wafers. A single exposed port may lose all the vacuum force.
- Utilizing its unique selective vacuum feature, CoreFlow end effector can acquire the wafer even if only one (out of dozen) vacuum nozzle is covered.
- The smart nozzle holds the sensitive wafer without twisting and breaking it.
- Optional: Vacuum sensors as an additional safety measure and quick replacement nozzle cartridge to enhance productivity
Download Data Sheet:
Non Contact Chuck
Download Data Sheet:
Non-Contact Semiconductor Chuck
CoreFlow’s air floating solution can be integrated into inspection, metrology and other semiconductor process systems, providing consistent and reliable handling of wafers with no contact at either the back or front side. When required, CoreFlow’s chuck can clamp the wafer’s front side while a process such as polishing/grinding, is applied on the back.
Pressure Vacuum (PV) Concept
CoreFlow is a world class solution provider of high accuracy handling and conveying aeromechanical systems to the semiconductor and FPD industries.
Do You Have Questions?
Feel free to give us a call:
+49 89 35 09 578 -0
Klaus Gailussend inquiry