Wafer with non-contact chuck
Non Contact Chuck
CoreFlow develops, manufactures and markets advanced handling and conveying solutions for Flat Panel Display (FPD) and Semiconductor equipment manufacturers.
With more than 800 installations worldwide, CoreFlow’s solutions can be found on the production floors of many top FPD manufacturing fab plants such as Samsung, LG, Sony, and more. In these fabs, CoreFlow solutions reliably handle the glass substrates.
On the semiconductor market, the CoreFlow product is found inside inspection and material characterization machines.
CoreFlow’s non-contact air floating solutions transport substrates (glass or/and wafer) of any size, thickness, and weight (including the latest G10.5 and 0.1 mm thicknesses), between and within process systems with the utmost air-gap accuracy.
The heart of CoreFlow’s technology is SmartNozzle™.
This unique Nozzle enables the precise substrate floating and allows a selective vacuum in other applications.
That indicates that a partially covered stage or chuck can still acquire and retain the substrate even though a large part of the vacuum area is not covered by the substrate.
This addresses the challenge of handling warped and odd-shaped substrates.
CoreFlow brings several decades of combined aeromechanical expertise to deliver manufacturing solutions with unmatched quality, accuracy, and stability – solutions that minimize your risk and maximize your manufacturing yield and throughput.
CoreFlow’s headquarters and research facilities are based in Israel, with sales representatives located in Germany, Korea, Japan, Taiwan, and China.
CoreFlow is a world class solution provider of high accuracy handling and conveying aeromechanical systems to the semiconductor and FPD industries.
Do You Have Questions?
Feel free to give us a call:
+49 89 35 09 578 -0
Klaus Gailussend inquiry