Processes & Applications

ALD Process

• ALD System → Arradiance

Information about ALD

Automation and Service

• Automation auditing and calibration of your fab → EURIS
• Emulator E84, IR Transceiver, Vibration tester → Get Control

Backend

• Curing → LAMBDA Technologies

Cleanroom & Consumables

• Vacuum chamber cleaning products (Diamond Scrub Pads, microsponge, ultraclean wipers) → EURIS DSP

Diamond Scrub Pads (DSP)

• Cost-effective single wafer box → EURIS SWB
• New, used and factory overrun, wafer handling products → Electronic Container Corporation ECC
  
• Cost-effective CMP polish rings → EURIS

Cleaning

• Vacuum chamber cleaning products (Diamond Scrub Pads, microsponge, ultraclean wipers) → EURIS DSP

Manual resistivity measurement

Four-Point Probe Method or Eddy Current Method.

More about manual resistance measurement >

Metrology & Control

• Resistivity, Sheet Resistance, Flatness, Thickness, P/N Type judgment, and Wafer Sorting → Napson
• Resistivity probes, resistivity measurement → Jandel
• High Quality 3D Surface Metrology → FRT
• Thickness, roughness, and geometry measurement → NanoSystem
• Submicrometer flatness measurement → Corning Tropel
• Emulator E84, IR Transceiver, Vibration tester → Get Control

Photomask processing

• Photomasks flatness measurement →Corning Tropel
  

Polishing / CMP

• • CMP Systems → Okamoto

• Slurry equipment supply tank → EURIS

Wafer processing

• • Dielectric film curing → Lambda Technologies
  • Grinding system → Okamoto
  • TSV process → Okamoto
  • Thin-film processing systems → Arradiance

• ALD Systems → Arradiance