Okamoto Machine Tool Europe GmbH
Supply the correct Technology
Supplying systems to thin Semiconductor substrates and emerging technology to achieve the best results in accuracy and efficiency. Developing tools to produce the best surface quality and dimensional accuracy for hard and brittle materials.
Always work closely together with our customers and user in order to provide the most suitable solutions for the application.
Grinding lapping and polishing system for the semiconductor industry. From RD standalone tools to fully integrated cluster systems.
Do You Have Questions?
Feel free to give us a call:
+49 89 35 09 578 -0