UDM Systems
UDM Systems, LLC
Wafer Dicing & Surface Cleaning Solutions for Semiconductor, Solar & Biomedical
UDM Systems, LLC is a global chemical and equipment manufacturing company based in the United States. We offer high-performance products that are suitable for many industries, such as Semiconductor, Solar, Optoelectronics, Biomedical, LED, Precision Glass & Optics, and much more. UDM Systems, LLC offers a completely eco-friendly set of solutions for wafer-die separation needs.
Advantages and Suitable for:
- Lubricants for Dicing and Grinding
- Wafer dicing lubricant
- Semiconductor wafer Dicing
- Dicing blade
- Coolant for Slicing, Grinding and back side grinding
- Dicing Saws
- Wafer cut quality
- Reducing Back side chipping andTop side chipping
- Reducing Micro cracks
- Die singulation
- Die or Chip separation
- Wafer singulation
- Coolant-lubricant
- No Wafer or surface contamination
- Wafer surface cleaning solution
- Water surface tension
- DI Water surface tension
- ESD = Electro static discharge Reduction
Do You Have Questions?
Feel free to give us a call:
+49 89 35 09 578 -0
Joos Hanssen
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