UDM Systems
UDM Systems, LLC
Wafer Dicing & Surface Cleaning Solutions for Semiconductor, Solar & Biomedical
UDM Systems, LLC is a global chemical and equipment manufacturing company based in the United States. We offer high-performance products that are suitable for many industries, such as Semiconductor, Solar, Optoelectronics, Biomedical, LED, Precision Glass & Optics, and much more. UDM Systems, LLC offers a completely eco-friendly set of solutions for wafer-die separation needs.
Advantages and Suitable for:
- Lubricants for Dicing and Grinding
- Wafer dicing lubricant
- Semiconductor wafer dicing
- Dicing blade
- Coolant for slicing, grinding and back side grinding
- Dicing Saws
- Wafer cut quality
- Reducing back side chipping and top side chipping
- Reducing micro cracks
- The singulation
- Die or chip separation
- Wafer singulation
- Coolant-lubricant
- No wafer or surface contamination
- Wafer surface cleaning solution
- Water surface tension
- DI Water surface tension
- ESD = Electrostatic Discharge Reduction
